Method and apparatus for dynamic lithographic exposure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJun-Yih Yu, De-Fang Huang, De-Chen Tseng, Jia-Feng Chang, Li-Fang Hsu
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Abstract
The present disclosure, in some embodiments, relates to a method of developing a photosensitive material. The method includes forming a photosensitive material over a substrate. The photosensitive material is exposed to electromagnetic radiation focused at a plurality of different heights over the substrate. The plurality of different heights are vertically separated from one another and are disposed within the photosensitive material along a vertical path that extends in a direction perpendicular to an upper surface of the photosensitive material. The photosensitive material is developed to remove a soluble region.
Claims20
A method of developing a photosensitive material, comprising:
- forming a photosensitive material over a substrate;
- exposing the photosensitive material to electromagnetic radiation focused at a plurality of different heights over the substrate, wherein the plurality of different heights are vertically separated from one another and are disposed within the photosensitive material along a vertical path that extends in a direction perpendicular to an upper surface of the photosensitive material;
- and
- developing the photosensitive material to remove a soluble region.
A method of performing a photolithography process, comprising:
- forming a photosensitive material to have a substantially flat upper surface over a substrate;
- exposing the photosensitive material to electromagnetic radiation that is focused at a plurality of different heights over the substrate at different times, wherein the photosensitive material is exposed in a pattern that corresponds to a photomask and that extends over the substantially flat upper surface of the photosensitive material;
- and
- developing the photosensitive material to remove a part of the photosensitive material.
A method of performing a photolithography process, comprising:
- forming a photosensitive material to have a substantially flat upper surface over a substrate;
- focusing electromagnetic radiation over a first depth of focus at a first time, wherein the first depth of focus is centered within the photosensitive material;
- focusing the electromagnetic radiation over a second depth of focus at a second time, wherein the second depth of focus is centered within the photosensitive material;
- wherein the first depth of focus is directly over the second depth of focus;
- and
- wherein the first depth of focus and the second depth of focus define a collective depth of focus having a dose that is largest at a point that is vertically between a center of the first depth of focus and a center of the second depth of focus.
Dependencies are inferred from the claim text.