Core and interface scan testing architecture and methodology
AssigneeMicron Technology, Inc.
InventorsBanadappa Shivaray, Shrikrishna Pundoor, Mahesh Rawal, Aviral Agarwal
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AssigneeMicron Technology, Inc.
InventorsBanadappa Shivaray, Shrikrishna Pundoor, Mahesh Rawal, Aviral Agarwal
Estimating the term…
Implementations described herein relate to a core and interface scan testing. In some implementations, an integrated circuit may include input scan flip-flops (ISFFs) arranged in multiple ISFF stages that include a first ISFF stage and a second ISFF stage. Inputs to the first ISFF stage are connected to inputs of the integrated circuit. Inputs to the second ISFF stage are connected to outputs of a logic component that is connected to outputs of the first ISFF stage. The integrated circuit may include output scan flip-flops (OSFFS) arranged in multiple OSFF stages that include a first OSFF stage and a second OSFF stage. Outputs from the first OSFF stage are connected to outputs of the integrated circuit. Outputs from the second OSFF stage are connected to inputs of a logic component that is connected to inputs of the first OSFF stage. The integrated circuit may include core scan flip flops.
An integrated circuit, comprising:
A system, comprising:
A method, comprising:
A method, comprising:
Dependencies are inferred from the claim text.