Force torque sensor device including sensor chip bonded to strain body by adhesive

A force torque sensor device comprising:

• a sensor chip that detects a displacement in a predetermined axis direction, the sensor chip being a micro-electro-mechanical systems sensor chip;
• a strain body that transmits an applied force to the sensor chip, the strain body being made of a metallic material;
• and
• adhesives that bond the sensor chip to adhesive portions of the strain body,
• wherein a Young's modulus of each of the adhesives is greater than or equal to 500 MPa and less than or equal to 1.5 GPa and a thickness of each of the adhesives is greater than or equal to 10 μm and less than or equal to 40 μm,
• wherein the sensor chip is formed of a silicon semiconductor substrate and includes:
• a plurality of supports bonded to the strain body to fix the sensor chip to the stain body;
• and
• a plurality of force points bonded to the adhesive portions of the strain body by the adhesives to transmit the applied force to the sensor chip,
• wherein the strain body includes beams having protrusions and the adhesive portions are surfaces of the protrusions,
• wherein the applied force deforms the beams of the strain body to displace the protrusions, and the adhesives bond the force points of the sensor chip to the surfaces of the protrusions so that the displacement of the protrusions is transmitted to the force points of the sensor chip, and
• wherein each of the adhesives is a modified silicone.