Polishing pad, polishing apparatus and method of manufacturing semiconductor package using the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuan-Cheng Wang, Ching-Hua Hsieh, Yi-Yang Lei
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Abstract
A polishing pad, a polishing apparatus and a method of manufacturing a semiconductor package using the same are provided. In some embodiments, a polishing pad includes a sub-pad portion and a top pad portion over the sub-pad portion. The top pad portion includes a plurality of grooves having a first width and a plurality of openings having a second width different from the first width, and the openings are located in a center zone of the polishing pad.
Claims20
A method of manufacturing a semiconductor package, comprising:
- placing a die on a carrier;
- forming a material layer over the die;
- and
- polishing the material layer using a polishing pad, so as to reduce a height of the material layer, wherein the polishing pad comprises a plurality of grooves having a first width and a plurality of openings having a second width greater than the first width, and the plurality of openings are distributed asymmetrically with respect to a center point of the polishing pad,
- wherein the grooves are intersecting X-Y patterns of continuous grooves, and some of the openings intersect at least three of the continuous grooves, and
- wherein the openings penetrate through the polishing pad, while the grooves do not penetrate through the polishing pad.
A method of manufacturing a semiconductor package, comprising:
- forming a material layer over a carrier;
- and
- polishing the material layer using a polishing pad, wherein the polishing pad comprises a plurality of grooves and a plurality of openings, and the grooves are distributed uniformly across the polishing pad while the openings are distributed locally across the polishing pad,
- wherein during the polishing, the plurality of openings of the polishing pad are overlapped with the carrier,
- wherein the grooves are intersecting X-Y patterns of continuous grooves, and some of the openings intersect at least three of the continuous grooves, and
- wherein the openings penetrate through the polishing pad, while the grooves do not penetrate through the polishing pad.
A method of manufacturing a semiconductor package, comprising:
- forming a material layer over a carrier;
- and
- polishing the material layer using a polishing pad, so as to reduce a height of the material layer, wherein the polishing pad comprises a plurality of grooves having a first width and a plurality of openings having a second width greater than the first width, and the plurality of openings are distributed asymmetrically with respect to a center point of the polishing pad,
- wherein from a top view, the plurality of openings of the polishing pad are positioned over the carrier during the polishing, wherein a diameter of the carrier is greater than a radius of the polishing pad,
- wherein the grooves are intersecting X-Y patterns of continuous grooves, and some of the openings intersect at least three of the continuous grooves, and
- wherein the openings penetrate through the polishing pad, while the grooves do not penetrate through the polishing pad.
Dependencies are inferred from the claim text.