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US 11,878,345 B2Granted
Thixomolding material
AssigneeSeiko Epson Corporation
InventorsShunsuke Uchizono, Setsuya Iwashita, Yasutoshi Hideshima, Fumiya Maeda, Koichi Ozaki, Tadao Fukuta
Life of this patent
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Abstract
A thixomolding material includes: a metal body that contains Mg as a main component; and a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component. A mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less. The binder may contain waxes. A content of the binder may be 0.001 mass % or more and 0.200 mass % or less.
Claims3
A thixomolding material comprising:
- a metal body that contains Mg as a main component;
- and
- a coating portion that is adhered to a surface of the metal body via a binder and contains SiC particles containing SiC as a main component, wherein
- a mass fraction of the SiC particles in a total mass of the metal body and the SiC particles is 2.0 mass % or more and 40.0 mass % or less.
1 more element
Dependencies are inferred from the claim text.