Resin composition, polishing pad, and method for producing polishing pad

A resin composition comprising:

• a urethane (meth)acrylate (A),
• an unsaturated resin (B) consisting of at least one of a vinyl ester resin and an unsaturated polyester resin,
• an ethylenically unsaturated compound (C) having an ethylenically unsaturated bond and excluding the urethane (meth)acrylate (A) and the unsaturated resin (B), and
• a hollow body (D),
• wherein the urethane (meth)acrylate (A) is represented by the following general formula,
• wherein R1 is H or CH3, R2 is a divalent hydrocarbon group which may contain an ether bond and in which a hydrogen atom may be substituted with a substituent, R3 is a divalent hydrocarbon group, and R4 is a structural unit derived from a polyester polyol having a weight-average molecular weight of 2,000 to 8,000, and n, which is the number of repeating units, is an average value based on the number of the entire urethane (meth)acrylate (A) contained in the resin composition and is a real number of 1.00 or greater,
• wherein a mass ratio A:B of the content of the urethane (meth)acrylate (A) and the content of the unsaturated resin (B) is 64:36 to 96:4,
• wherein the content of the hollow body (D) with respect to 100 parts by mass of the total of the urethane (meth)acrylate (A), the unsaturated resin (B) and the ethylenically unsaturated compound (C) is 0.7 to 9.0 parts by mass,
• wherein the value of n in the general formula is 1.00 to 6.00, and
• wherein the unsaturated resin (B) is an epoxy (meth)acrylate having a weight-average molecular weight of 1,000 to 6,000, or an unsaturated polyester resin having a weight-average molecular weight of 6,000 to 35,000.