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US 11,871,978 B2Granted
Plasma scalpel for selective removal of microbes and microbial biofilms
AssigneeBoise State University
InventorsJim Browning, Ken Cornell
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Abstract
The disclosure relates to the medical device field. In particular, the disclosure relates to a dynamically controlled plasma scalpel in combination with an imaging system to selectively remove biofilm while minimizing damage to healthy tissue. Systems and apparatuses according to the disclosure include: (1) dynamically controlled plasma scalpel, (2) biofilm imaging system, (3) computer control system, (4) three-dimensional scalpel positioning stage, and (5) biofilm detritus removal system.
Claims19
A plasma scalpel system comprising:
- at least one plasma scalpel dynamically controlled by a computer control system, wherein the computer control system controls (i) movement of the plasma scalpel in three dimensions with high spatial precision;
- and (ii) a variable biofilm etch rate in real time using system operating parameters;
- a biofilm imaging system that marks a biofilm in a wound and/or necrotic tissue and provides a spatial location of the biofilm to the computer control system, wherein the biofilm imaging system marks the biofilm and/or the necrotic tissue by staining the biofilm and/or necrotic tissue;
- flushes the wound where the biofilm is located to remove excess stain;
- and illuminates the wound with visible light and a camera or fiber optic system;
- and
- a biofilm detritus removal system that removes bacteria and byproducts of a biofilm destroyed by the plasma scalpel.
4 more elements
Dependencies are inferred from the claim text.