Wireless board-to-board interconnect for high-rate wireless data transmission
AssigneeSamsung Electronics Co., Ltd.
InventorsAnton Sergeevich Lukyanov, Mikhail Nikolaevich Makurin
Life of this patent
Estimating the term…
Loading patent…
AssigneeSamsung Electronics Co., Ltd.
InventorsAnton Sergeevich Lukyanov, Mikhail Nikolaevich Makurin
Estimating the term…
Provided is a device for transmitting signals, the device including: a first conductive base and a second conductive base parallel to each other, a waveguide at least partially surrounded by side walls located between the first conductive base and the second conductive base and including at least one electromagnetic band gap (EBG) structure, and at least two directional antennas opposite to or facing each other in a direction in which signals are transmitted, wherein each antenna is on a printed circuit board and includes another EBG structure located on an upper layer and a lower layer of the printed circuit board and at least one matching element, at least a part of each of the antennas is located inside the waveguide to form a wireless channel configured to transmit electromagnetic signals in an area between the antennas, and the at least one matching element is located within a specified distance of the wireless channel and is configured to match the antenna with the wireless channel.
A device configured to transmit signals, comprising:
A device configured to transmit signals, comprising:
Dependencies are inferred from the claim text.