Photonic chip based atomic sensors
AssigneeVector Atomic, Inc.
InventorsMatthew Todd Cashen, Martin Machai Boyd, Christopher Scott Corder
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Abstract
Embodiments herein describe an atomic sensor that includes a photonic die that outputs optical signals on a top surface. These optical signals can be directed and shaped as needed to satisfy a particular type of atomic sensor. In one embodiment, an atomic source (e.g., rubidium or cesium) is disposed on the photonic chip to emit atoms when heated. A collimator can then direct the emitted atoms along a path that intersects with the optical signals. This intersection can be used to detect motion (e.g., rotation and acceleration) of the atomic sensor.
Claims23
An atomic sensor, comprising:
- a photonic die comprising a plurality of optical interfaces configured to emit a plurality of optical signals on a top surface;
- an atomic source disposed on the top surface, the atomic source configured to emit atoms;
- and
- a collimator disposed on the top surface, the collimator configured to receive the atoms from the atomic source and direct them onto an atomic path that intersects the plurality of optical signals emitted by the photonic die.
An atomic sensor, comprising:
- a photonic die comprising a plurality of optical interfaces configured to emit a plurality of optical signals;
- an atomic source disposed on the photonic die, the atomic source configured to emit atoms;
- a spacer disposed on the photonic die, the spacer comprising a collimator configured to receive the atoms from the atomic source and direct them onto an atomic path that intersects the plurality of optical signals emitted by the photonic die;
- and
- a lid disposed on the spacer to create a hermetic package under vacuum.
A method comprising:
- attaching a spacer to a photonic die comprising a plurality of optical interfaces configured to emit a plurality of optical signals;
- disposing an atomic source on the photonic die after attaching the spacer, wherein the spacer comprises a collimator configured to, during operation, receive atoms emitted by the atomic source and direct them onto an atomic path that intersects the plurality of optical signals emitted by the photonic die;
- and
- placing a lid on the spacer to create a hermetic package.
Dependencies are inferred from the claim text.