Defective soldering point intensive extent analysis system for solder paste inspection and method thereof

A defective soldering point intensive extent analysis system for a solder paste inspection, the defective soldering point intensive extent analysis system comprising:

• the solder paste inspection being configured to immediately detect a circuit board to generate a detection log after the circuit board is set with soldering paste, the detection log comprises information of defective soldering points of the detected circuit board, the solder paste inspection stores soldering pad information corresponding to the detected circuit board, the soldering pad information comprises information of soldering point set areas;
• and
• an analysis device, the analysis device comprising:
• a receiving module configured to receive the detection log and the soldering pad information from the solder paste inspection;
• an intensive extent analysis module configured to select one of the defective soldering points in the detection log as a center in sequential order, and use a preset aggregate radius as a determination range to determine whether the number of the defective soldering points within the determination range is higher than or equal to a preset number;
• an aggregate module configured to set the defective soldering points corresponding to the determination ranges as the same aggregate to calculate at least one defective soldering point area when the number of the defective soldering points within the determination range is higher than or equal to the preset number and the determination ranges have overlapped portions formed therebetween;
• a determination module configured to determine whether similar defective soldering point areas exist in successive N detection logs;
• a generation module configured to generate defective soldering point alert information according to statistics of the information of defective soldering points within the at least one defective soldering point area, a location and a size of the at least one defective soldering point area, and the soldering pad information and generate defective soldering point versus time analysis alert information according to statistics of the information of defective soldering points based on times of generating the N detection logs, a location and a size of the at least one defective soldering point area, and the soldering pad information when the determination module determines that the similar defective soldering point areas exist in the successive N detection logs, wherein N is a positive integer higher than or equal to 2;
• an analysis module configured to analyze and recognize the similar defective soldering point areas occurred on the plurality of circuit boards in the defective soldering point versus time analysis alert information, summarize the features of the defective soldering points in the at least one defective soldering point area, analyze causes of the defective soldering points, and feed the causes back to the solder paste inspection;
• and
• a display module configured to display the defective soldering point alert information in a table.