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US 11,865,609 B2Granted
Method for manufacturing powder-modified magnesium alloy chip
AssigneeSeiko Epson Corporation
InventorsKoichi Ozaki, Tadao Fukuta, Yasutoshi Hideshima, Makoto Kato
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Abstract
A method for manufacturing a powder-modified magnesium alloy chip for thixomolding includes a drying step of heating a mixture containing an Mg chip containing Mg as a main component, a C powder containing C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture, and a stirring step of stirring the mixture heated in the drying step.
Claims6
A method for manufacturing a powder-modified magnesium alloy chip for thixomolding, the method comprising:
- a drying step of heating a mixture containing an Mg chip containing Mg as a main component, a C powder containing C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture;
- a stirring step of stirring the mixture heated in the drying step;
- and
- a degreasing step of heating the mixture to remove at least a part of the binder contained in the mixture after the stirring step and the drying step are completed so that an attachment amount of the C powder attached to the Mg chip is 8.8% or greater and 28.0% or less after removal of the part of the binder, the attachment amount being a ratio of a weight of the C powder attached to the Mg chip with respect to a weight of the Mg chip, wherein
- the drying step and the stirring step are alternately performed for a plurality of times.
2 more elements
A method for manufacturing a powder-modified magnesium alloy chip, the method comprising:
- a drying step of heating a mixture containing an Mg chip containing Mg as a main component, a C powder containing C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture;
- a stirring step of stirring the mixture;
- and
- a degreasing step of heating the mixture to remove at least a part of the binder contained in the mixture after the stirring step and the drying step are completed so that an attachment amount of the C powder attached to the Mg chip is 8.8% or greater and 28.0% or less after removal of the part of the binder, the attachment amount being a ratio of a weight of the C powder attached to the Mg chip with respect to a weight of the Mg chip, wherein
- the drying step and the stirring step are performed at the same time.
2 more elements
Dependencies are inferred from the claim text.