Depositing of material by spraying precursor using supercritical fluid

An apparatus for depositing material on a substrate, comprising:

• a spraying module configured to spray a precursor onto the substrate;
• a plasma reactor physically separated from the spraying module, the plasma reactor comprising electrodes extending vertically and an insulation body separating the electrodes, a voltage difference applied across the electrodes to generate radicals;
• a passage formed between the spraying module and the plasma reactor, the passage configured to receive a spread gas for a first portion of the spread gas entering the plasma reactor to generate the radicals and a second portion of a spread gas entering the spraying module to separate the radicals and the precursor;
• an actuator coupled to the spraying module or the plasma reactor and configured to change a vertical location of the spraying module relative to a vertical location of the plasma reactor, the vertical location of the spraying module relative to the vertical location of the plasma reactor controlling an amount of the first portion of the spread gas and an amount of the second portion of the spread gas;
• a container configured to contain supercritical carrier fluid;
• an exchanger coupled to the container to receive the supercritical carrier fluid and dissolve a solid precursor into the supercritical carrier fluid;
• and
• a regulator between the exchanger and the spraying module to regulate flow of the supercritical carrier fluid from the exchanger to the spraying module.