Correcting component failures in ion implant semiconductor manufacturing tool

A method comprising:

• identifying historical sensor data associated with wafer or display manufacturing equipment;
• and
• identifying historical windows associated with the historical sensor data, wherein:
• corresponding data points of the historical sensor data in a normal operation window of the historical windows are substantially stable along a first health index value;
• the corresponding data points of the historical sensor data in a pre-failure window of the historical windows increase from the first health index value to a peak at a second health index value;
• and
• the historical sensor data and the historical windows are to be used to determine, based on current sensor data, whether one or more components are within the pre-failure window to cause performance of a corrective action associated with the one or more components.

A system comprising:

• a memory;
• and
• a processing device coupled to the memory, the processing device to:
• determine, based on sensor data, that one or more components of wafer or display manufacturing equipment are within a pre-failure window that is after a normal operation window, wherein corresponding data points in the normal operation window are substantially stable along a first health index value, wherein the corresponding data points in the pre-failure window increase from the first health index value to a peak at a second health index value;
• and
• responsive to determining that the one or more components are within the pre-failure window, cause performance of a corrective action associated with the one or more components of the wafer or display manufacturing equipment.