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US 11,858,860 B2Granted
Sintering jig
AssigneeSamsung Electronics Co., Ltd.
InventorsGiyoung Jo, Chan Kwak, Taewon Jeong
Life of this patent
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Abstract
A sintering jig according to the disclosure includes a first plate including a plurality of protrusions and a second plate stacked on the first plate and including through holes corresponding to the protrusions. The through hole includes a cylindrical portion through which the protrusion enter and exit and a conical portion widening towards an upper surface of the second plate from the cylindrical portion.
Claims8
A sintering jig comprising:
- a first plate comprising a plurality of protrusions on an upper surface thereof;
- and
- a second plate stacked on the first plate and comprising a plurality of through holes corresponding to the plurality of the protrusions,
- wherein each of the plurality of through holes comprises a cylindrical portion configured such that a corresponding one of the plurality of protrusions enters and exits from beneath the second plate, and a conical portion widening from the cylindrical portion towards an upper surface of the second plate.
1 more element
Dependencies are inferred from the claim text.