Method of manufacturing an assembly having a nominal thickness skin panel
AssigneeThe Boeing Company
InventorsBenjamin S. Merrit, Hsien-Lin Huang, Mark Abdouch, Nathan A. Secinaro, Daniel Bracy
Life of this patent
Estimating the term…
Loading patent…
AssigneeThe Boeing Company
InventorsBenjamin S. Merrit, Hsien-Lin Huang, Mark Abdouch, Nathan A. Secinaro, Daniel Bracy
Estimating the term…
A method of manufacturing a panel assembly includes supporting the panel assembly in a free state using a holding fixture. The panel assembly has a skin panel, and sacrificial material coupled to a skin panel inner surface. The method includes acquiring a free state outer surface contour of the panel assembly by scanning a skin panel outer surface while the panel assembly is supported by the holding fixture. The method also includes developing a numerically controlled (NC) machining program having cutter paths configured for machining the interface locations to an inner surface contour that reflects nominal thicknesses of the panel assembly based off of the free state outer surface contour. In addition, the method includes machining the sacrificial material at the interface locations by moving a cutter along the cutter paths while the panel assembly is supported by the holding fixture.
A method of manufacturing a panel assembly, comprising:
A method of manufacturing a panel assembly, comprising:
A method of manufacturing an aerostructure of an aircraft, comprising:
Dependencies are inferred from the claim text.