Polishing layer and polishing method
AssigneeIV Technologies CO., Ltd.
InventorsYu-Hao Pan, Ching-Huang Shen, Yu-Piao Wang
Life of this patent
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Abstract
A polishing layer is provided. The polishing layer have a surface pattern, a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, each of the grooves is disposed between every two adjacent polishing portions, and the polishing layer comprises a body layer and a surface layer. The surface layer is disposed on a surface of the body layer, and a top of at least one of the polishing portions has at least one flattened region exposing the body layer.
Claims6
A polishing layer having a surface pattern, wherein a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, the direction includes a first direction parallel to an X-axis direction, a second direction parallel to a Y-axis direction, a third direction at an angle with the X-axis direction, a radius direction or a circumferential direction, and each of the grooves is disposed between every two adjacent polishing portions, wherein the polishing layer comprises:
- a body layer, wherein the body layer comprises at least one flattened region;
- and
- a surface layer disposed on a surface of the body layer, wherein the surface layer exposes the at least one flattened region of the body layer, wherein the polishing layer has a perfusion flow mark, and the at least one flattened region is located at an end of the perfusion flow mark.
Dependencies are inferred from the claim text.