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US 11,858,066 B2Granted
Laser processing machine with fluid flow nozzle cleaning device
AssigneeBystronic Laser AG
InventorsHeinz Oberholzer, Matthias Wüthrich
Life of this patent
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Abstract
The invention relates to a laser processing machine (11) with a laser processing head (12), with a support grate (16) that defines a support plane (A) for supporting a workpiece (8) to be processed, with a fluid supply device (21) and with a fluid removal device (31). The fluid supply device (21) and fluid removal device (31) are designed to generate a fluid flow (27) under the support plane (A) of the support grate (16). The fluid supply device (21) can be moved with the laser processing head (12).
Claims16
A laser cutting machine for processing a workpiece comprising:
- a laser cutting head;
- a support grate, wherein the support grate defines a support plane configured for supporting a workpiece to be processed by the laser cutting machine;
- at least one fluid supply device and at least one fluid removal device, wherein the at least one fluid supply device and at least one fluid removal device are configured to generate a fluid flow under the support plane of the support grate capable of removing flue gas and dust generated by the processing of the workpiece;
- wherein the at least one fluid supply device is additionally configured for a parallel direction of movement with a movement of the laser cutting head, and
- wherein the at least one fluid supply device further includes at least one nozzle arranged therein or thereon,
- at least one nozzle cleaning device configured to clean the at least one nozzle.
3 more elements
Dependencies are inferred from the claim text.