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US 11,856,856 B2Granted
Thermal conduction unit, electronic module and heat dissipating device
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorWen-Long Lu
Life of this patent
Estimating the term…
Abstract
A thermal conduction unit includes a conductive via, a periphery conductor and an isolation material. The conductive via includes a first thermoelectric material. The periphery conductor encloses the conductive via and includes a second thermoelectric material. An end of the periphery conductor is electrically connected to an end of the conductive via. The isolation material is interposed between the conductive via and the periphery conductor.
Claims14
An electronic structure, comprising:
- a substrate having a top surface and a bottom surface opposite to the top surface;
- a first thermal conduction structure embedded in the substrate, and comprising:
- a first conductive via including a first semiconductor material, and comprising an upper portion and a lower portion under the upper portion, wherein a step structure is defined by an inner surface of the upper portion and an inner surface of the lower portion, and;
- a first periphery conductor enclosing the first conductive via and including a second semiconductor material, wherein the first periphery conductor is electrically connected to the first conductive via;
- and
- a first isolation material interposed between the first conductive via and the first periphery conductor, wherein the upper portion includes a first horizontally extending portion extending into the first isolation material, and the lower portion defines a lower hollow structure exposing the first horizontally extending portion;
- an electronic device disposed on the top surface of the substrate, and having an active surface facing the substrate;
- and
- a first dielectric layer disposed on the first isolation material and accommodating the upper portion of the first conductive via, wherein the first horizontally extending portion is disposed on a bottom surface of the first dielectric layer.
6 more elements
An electronic structure, comprising:
- a substrate having a top surface and a bottom surface opposite to the top surface;
- a first thermal conduction structure embedded in the substrate, and comprising:
- a first conductive via comprising a first upper portion and a first lower portion, wherein the first upper portion is closer to the top surface of the substrate than the first lower portion is, wherein a first step structure is defined by an inner surface of the first upper portion and an inner surface of the first lower portion;
- and
- a second conductive via located at one side of the first conductive via, and comprising a second upper portion and a second lower portion, wherein the second upper portion is closer to the top surface of the substrate than the second lower portion is, wherein a second step structure is defined by an inner surface of the second upper portion and an inner surface of the second lower portion, wherein an elevation of the first step structure is higher than an elevation of the second step structure, wherein the second lower portion defines a lower hollow structure, the second upper portion defines an upper hollow structure communicated with the lower hollow structure;
- an electronic device disposed on the top surface of the substrate, and having an active surface facing the substrate;
- a first pad disposed on the second conductive via and extending into the upper hollow structure and the lower hollow structure, wherein the first pad has an inner surface and an outer surface opposite to the inner surface, the outer surface of the first pad is closer to the second conductive via than the inner surface of the first pad is, and the inner surface of the first pad is conformal with the second step structure;
- and
- a seed layer between the second conductive via and the first pad, wherein the seed layer has an inner surface and an outer surface opposite to the inner surface, the outer surface of the seed layer is closer to the second conductive via than the inner surface of the seed layer is, and the inner surface of the seed layer is conformal with the second step structure.
6 more elements
An electronic structure, comprising:
- a substrate having a top surface and a bottom surface opposite to the top surface;
- a first thermal conduction structure embedded in the substrate, and comprising:
- a first conductive via comprising a first upper portion and a first lower portion, wherein the first upper portion is closer to the top surface of the substrate than the first lower portion is, wherein a first step structure is defined by an inner surface of the first upper portion and an inner surface of the first lower portion;
- and
- a second conductive via located at one side of the first conductive via, and comprising a second upper portion and a second lower portion, wherein the second upper portion is closer to the top surface of the substrate than the second lower portion is, wherein a second step structure is defined by an inner surface of the second upper portion and an inner surface of the second lower portion, wherein an elevation of the first step structure is higher than an elevation of the second step structure;
- an electronic device disposed on the top surface of the substrate, and having an active surface facing the substrate;
- and
- a second thermal conduction structure disposed right under the first thermal conduction structure and electrically connected to the first thermal conduction structure, wherein a structure of the second thermal conduction structure is substantially same as a structure of the first thermal conduction structure.
5 more elements
Dependencies are inferred from the claim text.