Housing for a power semiconductor module arrangement

An arrangement, comprising:

• a housing;
• and
• a printed circuit board arranged vertically above the housing,
• wherein the housing comprises:
• sidewalls;
• at least one protrusion attached to the sidewalls and arranged on an outside of the housing at a lower end of the housing distant from the printed circuit board, at least one first through hole being provided in the at least one protrusion;
• a plurality of holding devices, each holding device being arranged inside a first through hole and/or between the printed circuit board and the first through hole;
• and
• a plurality of fastening elements configured to attach the housing to a heat sink or base plate,
• wherein each of the plurality of holding devices is configured to clamp a different one of the fastening elements such that the fastening elements are secured in defined positions, and to align each of the fastening elements with a different one of the first through holes,
• wherein the printed circuit board comprises a plurality of second through holes, each of the second through holes being arranged vertically above and aligned with a different one of the plurality of fastening elements,
• wherein a diameter of each of the second through holes is less than a largest diameter of the respective fastening element,
• wherein when a defined force is exerted on the fastening elements, the fastening elements are configured to move vertically through the respective first through holes in a direction away from the printed circuit board.