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US 11,854,794 B2Granted
Semiconductor cleaning equipment and method for cleaning through vias using the same
AssigneeNational Center for Advanced Packaging Co., Ltd.
InventorsDaping Yao, Liqiang Cao
Life of this patent
Estimating the term…
Abstract
A method for cleaning a through via including the following steps is provided: heating a cleaning fluid to a predetermined temperature; mixing the cleaning liquid with an inert gas and entering into a cleaning cavity; atomizing the cleaning liquid in an atomizer to spray on a wafer surface and to wet an inner wall and a bottom of the through via; and closing a cleaning liquid valve.
Claims12
A method for cleaning a through via, comprising:
- heating a cleaning liquid to a predetermined temperature;
- mixing the cleaning liquid with a first inert gas and entering into a cleaning chamber;
- atomizing the cleaning liquid in an atomizer, to spray on a wafer surface and to wet an inner wall and a bottom of the through via, wherein:
- the atomizer is a hollow cylinder, the top of the atomizer is sealed, one or more first through holes are on the side of the hollow cylinder, and the cleaning liquid enters the cleaning chamber through the first through holes, the first through hole comprises a straight through hole and an oblique through hole extending horizontally, the straight through hole is substantially vertical to the tangent line at the intersection of the straight through hole and the inner wall of the cylinder;
- and
- the oblique through hole forms a specific angle, but not a right angle, with the tangent line at the intersection of the oblique through hole and the inner wall of the cylinder, and when the fluid is connected to the first through hole, the fluid passes through the straight through hole to the center of the hollow cylinder, and the fluid enters the hollow cylinder through the oblique through hole in a direction inclined to the direction of the straight through hole, the cleaning liquid turns into a fog state after multiple impacts with the inner wall of the cleaning chamber;
- and
- closing a cleaning liquid valve.
5 more elements
A method for cleaning and passivating a through via, comprising:
- heating a cleaning liquid and a passivation solution to a predetermined temperature;
- mixing the cleaning liquid and the passivation solution with an inert gas and entering into a cleaning chamber;
- atomizing the cleaning liquid and the passivation solution in an atomizer, to spray on an wafer surface and wet an inner wall and a bottom of the through via, wherein:
- the atomizer is a hollow cylinder, the top of the atomizer is sealed, one or more first through holes are on the side of the hollow cylinder, and the cleaning liquid enter the cleaning chamber through the first through holes, the first through hole comprises a straight through hole and an oblique through hole extending horizontally, the straight through hole is substantially vertical to the tangent line at the intersection of the straight through hole and the inner wall of the cylinder;
- and
- the oblique through hole forms a specific angle, but not a right angle, with the tangent line at the intersection of the oblique through hole and the inner wall of the cylinder, and when the fluids are connected to the first through hole, they pass through the straight through hole to the center of the hollow cylinder, and enter the hollow cylinder through the oblique through hole in a direction inclined to the direction of the straight through hole, the fluids turn into a fog state after multiple impacts with the inner wall of the cleaning chamber;
- and
- closing a cleaning liquid valve and a passivation solution valve.
5 more elements
Dependencies are inferred from the claim text.