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AssigneeLpkf Laser & Electronics AG
InventorsRobin Krüger, Roman Ostholt, Norbert Ambrosius, Oktavia Ostermann, Bernd Rösener, Daniel Dunker, Arne Schnoor, Malte Schulz-Ruhtenberg
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The invention relates to a process for connecting glass substrates which allows glass substrates to be aligned in a site-specific manner and to subsequently be connected to one another, and to the site-specifically aligned and interconnected glass substrates. Generally, the process relates to connecting glass substrates to one another, optionally also without site-specific alignment. The interconnected glass substrates obtainable by processes according to the invention are characterized by a firm bond with one another, which is preferably formed by solidified glass solder that is in form-fitting engagement with the glass substrates. Therein, recesses, which are preformed in the glass substrate, with glass solder are used for aligning and optionally for connecting the glass substrates.
A process comprising steps of:
A process comprising steps of:
An assembly, comprising at least two glass substrates, a traversing recesses in each of the at least two glass substrates, the traversing recesses having an undercut that extends from a surface of its respective glass substrate, a surface of another one of the at least two glass substrates being in direct contact with the surface of the respective glass substrate, and solidified glass solder extending along and into the recess between the at least two glass substrates;
Dependencies are inferred from the claim text.