Programmable two-dimensional simultaneous multi-beam optically operated phased array receiver chip and multi-beam control method
AssigneeZhejiang Lab
InventorsQiang Zhang, Hui Yu
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AssigneeZhejiang Lab
InventorsQiang Zhang, Hui Yu
Estimating the term…
A programmable two-dimensional simultaneous multi-beam optically operated phased array receiver chip is manufactured based on silicon-on-insulator (SOI) and indium phosphide (InP) semiconductor manufacturing processes, including the SiN process. The InP-based semiconductor is used for preparing a laser array chip and a semiconductor optical amplifier array chip, the SiN is used for preparing an optical power divider, and the SOI semiconductor is used for preparing a silicon optical modulator, a germanium-silicon detector, an optical wavelength multiplexer, a true delay line, and other passive optical devices. The whole integration of the receiver chip is realized through heterogeneous integration of the InP-based chip and the SOI-based chip. Simultaneous multi-beam scanning can be realized through peripheral circuit programming control. The chip not only can realize two-dimensional multi-beam scanning, but also has strong expansibility, such that the chip can be used for ultra-wideband high-capacity wireless communication and simultaneous multi-target radar recognition systems.
A programmable two-dimensional simultaneous multi-beam light-operated phased array receiver chip, comprising an indium phosphide (InP) photonic chip and a silicon-on-insulator (SOI) photonic chip that are heterogeneously integrated;
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