Additive manufacturing for integrated circuit assembly connector support structures
AssigneeIntel Corporation
InventorsAdel Elsherbini, Feras Eid, Johanna Swan, Georgios Dogiamis
Life of this patent
Estimating the term…
Abstract
Cables, cable connectors, and support structures for cantilever package and/or cable attachment may be fabricated using additive processes, such as a coldspray technique, for integrated circuit assemblies. In one embodiment, cable connectors may be additively fabricated directly on an electronic substrate. In another embodiment, seam lines of cables and/or between cables and cable connectors may be additively fused. In a further embodiment, integrated circuit assembly attachment and/or cable attachment support structures may be additively formed on an integrated circuit assembly.
Claims20
An integrated circuit assembly, comprising:
- an electronic board;
- an electronic substrate having a first surface and an opposing second surface, wherein the second surface of the electronic substrate is in electrical contact with the electronic board;
- an integrated circuit device having a first surface and an opposing second surface, wherein the first surface of the integrated circuit device is electrically attached to the first surface of the electronic substrate;
- a heat dissipation device in thermal contact with the second surface of the integrated circuit device;
- a side mount module comprising a side mount connector electrically attached to the electronic board and a side mount bridge electrically attached to the side mount connector and the first surface of the electronic substrate;
- and
- an additive support structure extending between and fused to the heat dissipation device and the side mount module.
An integrated circuit assembly, comprising:
- an electronic board;
- an electronic substrate having a first surface and an opposing second surface, wherein the second surface of the electronic substrate is in electrical contact with the electronic board;
- an integrated circuit device having a first surface and an opposing second surface, wherein the first surface of the integrated circuit device is electrically attached to the first surface of the electronic substrate;
- a heat dissipation device in thermal contact with the second surface of the integrated circuit device;
- a side mount module comprising a side mount connector attached to the electronic board and a side mount bridge attached to the side mount connector and the first surface of the electronic substrate;
- a data cable attached to the side mount connector;
- and
- an additive support structure extending between the heat dissipation device and the side mount module.
A method of fabricating an integrated circuit assembly, comprising:
- forming an electronic board;
- forming an electronic substrate having a first surface and an opposing second surface;
- electrically contacting the second surface of the electronic substrate with the electronic board;
- forming an integrated circuit device having a first surface and an opposing second surface;
- electrically attaching the first surface of the integrated circuit device to the first surface of the electronic substrate;
- forming a heat dissipation device;
- thermally contacting the heat dissipation device with the second surface of the integrated circuit device;
- forming a side mount module comprising a side mount connector and a side mount bridge;
- attaching the side mount connector to the electronic board;
- attaching the side mount bridge to the side mount connector and the first surface of the electronic substrate;
- and
- forming an additive support structure extending between and fused to the heat dissipation device and the side mount module.
Dependencies are inferred from the claim text.