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US 11,841,343 B2Granted
Method of processing substrate, substrate processing apparatus, method of manufacturing semiconductor processing apparatus, and recording medium
AssigneeKokusai Electric Corporation
InventorsTeruo Yoshino, Naofumi Ohashi, Toshiro Koshimaki
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Abstract
There is provided a technique that includes abnormality detecting by picking up a sound generated from a transfer configured to be capable of transporting the substrate and comparing a waveform of sound data with a preset threshold value to detect an abnormality of the transfer; and failure detecting by picking up vibration of the transfer and comparing a waveform of vibration data with a preset threshold value to detect a failure of the transfer.
Claims18
A method of processing a substrate, comprising:
- abnormality detecting by picking up a sound generated from a transfer that is configured to be capable of operating in a vacuum and transporting the substrate in a vacuum transfer chamber, and comparing a waveform of sound data with a preset threshold value to detect an abnormality of the transfer;
- and
- failure detecting by picking up vibration of the transfer and comparing a waveform of vibration data with a preset threshold value to detect a failure of the transfer,
- wherein the transfer is arranged in the vacuum transfer chamber,
- wherein a gas-filled container is filled with a gas, is installed with a microphone inside the gas-filled container, is installed to the transfer, and is arranged in the vacuum transfer chamber, and
- wherein the act of the abnormality detecting includes receiving sound data detected by the microphone.
3 more elements
A substrate processing apparatus, comprising:
- a process chamber configured to be capable of processing a substrate;
- a first transfer configured to be capable of transporting the substrate;
- a first transfer chamber configured to be capable of accommodating the first transfer;
- a sound information receiver configured to be capable of receiving sound information generated from the first transfer;
- a vibration information receiver configured to be capable of receiving vibration information generated from the first transfer;
- an abnormality detector configured to be capable of detecting an abnormality in the first transfer by comparing a waveform of the sound information with a preset threshold value;
- and
- a failure detector configured to be capable of detecting a failure of the first transfer by comparing a waveform of the vibration information with a preset threshold value,
- wherein the first transfer chamber is a vacuum transfer chamber,
- wherein the first transfer is configured to be capable of operating in a vacuum, and is arranged in the vacuum transfer chamber,
- wherein a gas-filled container is filled with a gas, is installed with a first microphone inside the gas-filled container, is installed to the first transfer, and is arranged in the vacuum transfer chamber, and
- wherein the sound information receiver is configured to be capable of receiving sound information detected by the first microphone.
9 more elements
A method of manufacturing a semiconductor processing apparatus, comprising:
- transporting a substrate by a transfer that is configured to be capable of operating in a vacuum;
- maintaining a vacuum state of a transfer chamber accommodating the transfer;
- processing the substrate;
- receiving sound information for the transfer;
- receiving vibration information for the transfer;
- and
- performing, by an operation controller, at least one selected from the group of notification of an abnormality of an apparatus and stop of an operation when an abnormality is determined as a result of analysis of information received in the act of receiving the sound information or the act of receiving the vibration information,
- wherein a gas-filled container is filled with a gas, is installed with a microphone inside the gas-filled container, is installed to the transfer, and is arranged in the transfer chamber, and
- wherein the act of receiving the sound information for the transfer includes receiving sound information detected by the microphone in the vacuum state of the transfer chamber.
6 more elements
Dependencies are inferred from the claim text.