Mounting device

A mounting device which mounts a first component which includes an illuminant and a second component which does not include the illuminant onto a board, comprising:

• a component holder to hold the first component and the second component and to mount the first component and the second component onto the board;
• a moving structure to cause the component holder to move;
• a mark camera to image a region which includes at least a portion of the illuminant in the first component to acquire a light emitting component image;
• a parts camera configured to image at least the second component to acquire a holding state of the second component which is held by the component holder;
• an illuminant coordinates detector to detect coordinates of a specific part of the illuminant based on the light emitting component image imaged by the mark camera prior to the first component being mounted onto the board by the component holder;
• and a controller configured to control the component holder and the moving structure to perform the mounting of the first component such that the first component is held, the first component moves over the board, and the specific part of the illuminant is positioned at predetermined coordinates on the board based on the detected coordinates of the specific part, the controller configured to determine a presence or absence of abnormality in the second component based on the acquired holding state of the second component.

A method for manufacturing a board on which a first component that includes an illuminant and a second component that does not include the illuminant are mounted, comprising:

• holding the first component and the second component with a component holder;
• moving the component holder with a moving structure;
• imaging with a mark camera (i) a region which includes at least a portion of the illuminant in the first component, to acquire a light emitting component image and (ii) a fiducial mark which is on the board to acquire a mark image;
• imaging at least the second component with a parts camera to acquire a holding state of the second component which is held by the component holder;
• detecting, with an illuminant coordinates detector, coordinates of a specific part of the illuminant based on the light emitting component image imaged by the mark camera;
• detecting, with a controller, coordinates of the board based on the mark image;
• controlling, with the controller, the component holder and the moving structure to perform mounting of the first component such that the first component is held, the first component moves over the board, and the specific part of the illuminant is positioned at predetermined coordinates on the board based on the detected coordinates of the specific part and the detected coordinates of the board which are detected;
• and
• determining a presence or absence of abnormality in the second component based on the acquired holding state of the second component.

A method for manufacturing a board on which a first component that includes an illuminant and a second component that does not include the illuminant are mounted, comprising:

• holding the first component and the second component with a component holder;
• moving the component holder with a moving structure;
• imaging a region which includes at least a portion of the illuminant in the first component with a mark camera, to acquire a light emitting component image;
• imaging at least the second component, with a parts camera, to acquire a holding state of the second component which is held by the component holder;
• detecting coordinates of a specific part of the illuminant based on the light emitting component image imaged by the mark camera prior to mounting of the first component onto the board using the component holder;
• controlling, with a controller, the component holder and the moving structure to perform the mounting of the first component such that the first component is held, the first component moves over the board, and the specific part of the illuminant is positioned at predetermined coordinates on the board based on the detected coordinates of the specific part;
• and
• determining a presence or absence of abnormality in the second component based on the acquired holding state of the second component.