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US 11,832,424 B2Granted
Electronic module
AssigneeSumitomo Wiring Systems, Ltd.
InventorKazuya Komaki
Life of this patent
Estimating the term…
Abstract
Provided is an electronic module including a housing case for housing a relay, a heat transfer sheet placed on one wall portion of the housing case, a bus bar that is connected to the relay and is partially in contact with the heat transfer sheet, and a pressing portion that presses the bus bar against the heat transfer sheet.
Claims11
An electronic module comprising:
- a housing case for housing an electronic component, the housing including a bottom plate, the electronic component including a terminal and a main body, the terminal disposed on a bottom surface of the main body;
- a heat transfer sheet that is placed on an inner surface of the bottom plate of the housing case;
- a bus bar that is connected to the terminal of the electronic component, the bus bar interposed between the heat transfer sheet and the terminal of the electronic component;
- and
- a pressing portion that presses the bus bar against the heat transfer sheet.
2 more elements
Dependencies are inferred from the claim text.