Dissipating device
AssigneeTherlect Co., Ltd
InventorChien Yu Chen
Life of this patent
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Abstract
A dissipating device configured to dissipate the heat energy generated by the heat sources in the electronic devices. When the dissipating device contacts the heat sources, the heat energy can be absorbed by the dissipating device. The working fluid is stored within the dissipating device such that the working fluid can undergo a phase transition after the dissipating device absorbs heat energy. Then the working fluid can circulate inside the dissipating device. Accordingly, the heat-dissipation mechanism, which is applied to the dissipating device contacting the electronic devices, can be effectively sped up. The dissipating device is formed into a thin structure to achieve an excellent heat-dissipation effect with a limited heat-dissipation area.
Claims10
A dissipating device for dissipating heat energy of an electronic device, comprising:
- a first sheet body with a through hole;
- a second sheet body;
- an adhesive member coated on opposing edges of the first sheet body and the second sheet body, so that the first sheet body is correspondingly adhered to the second sheet body by the adhesive member to form a width of a working space, the working space being created in which a working fluid is filled when the first sheet body the second sheet body are adhered together;
- and a sealing member positioned above a surrounding part of the through hole to seal the working space, wherein, after an ultrasonic welding process is performed around the through hole of the first sheet body, the surrounding part of the through hole is attached and welded to the second sheet body for sealing the through hole.
Dependencies are inferred from the claim text.