Sensor and sensor manufacturing method
AssigneeOMRON Corporation
InventorsTsuyoshi Miyata, Hiroyuki Mizusaki, Yasuyoshi Sawada, Yoshiki Tani
Life of this patent
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Abstract
Provided is a sensor which makes it easy to mount a cable to a circuit board. This sensor 1 is provided with: a circuit board 2; a connector 10 which is composed of a metal material and which is fixed to the circuit board 2; and a cable 3 which is connected to the circuit board 2 via the connector 10. The connector 10 has: a bottom part 11 that is connected to the circuit board 2; and a pair of pinching elements 12L, 12R that are raised upright from said bottom part 11. The cable 3 is held in a space S between the pair of pinching elements 12L, 12R.
Claims13
A sensor comprising:
- a circuit board;
- a connector which is composed of a metal material and which is fixed to the circuit board;
- and
- a cable which is connected to the circuit board via the connector, wherein the cable includes a plurality of strands and an outer covering bundling the plurality of strands, and each of the strands includes a core wire and an inner covering the core wire,
- wherein the connector includes:
- a bottom part, comprising a base, connected to the circuit board;
- a first pinching part, comprising a first pair of protrusions raised upright from the bottom part and bent back towards the bottom part forming a first pair of substrates extending substantially parallel to the first pair of protrusions;
- and
- a second pinching part, comprising a second pair of protrusions raised upright from the bottom part, wherein the cable is pinched in a space sandwiched by the second pair of protrusions, and
- wherein the cable is pinched in a space sandwiched by the first pair of protrusions
- wherein the first pair of substrates further includes a returning part provided so that an interval of the first pair of substrates becomes narrow as it goes away from the bottom part, and
- wherein the returning part is formed to be narrower than a diameter of the inner covering in a portion in which the interval of the first pair of substrates is the narrowest.
A sensor manufacturing method comprising:
- a first step of forming a connector including a bottom part and a first pair of protrusions raised upright from the bottom part and bent back towards the bottom part forming a first pair of substrates extending substantially parallel to the first pair of protrusions by a metal material;
- a second step of connecting the connector to a circuit board;
- and
- a third step of pressing a cable toward the bottom part and pinching the cable in a space sandwiched between the first pair of protrusions, wherein the cable includes a plurality of strands and an outer covering bundling the plurality of strands, and each of the strands includes a core wire and an inner covering the core wire, the first pair of substrates further includes a returning part provided so that an interval of the first pair of substrates becomes narrow as it goes away from the bottom part, and the returning part is formed to be narrower than a diameter of the inner covering in a portion in which the interval of the first pair of substrates is the narrowest,
- wherein the cable includes a plurality of strands and an outer covering bundling the plurality of strands,
- wherein each of the strands includes a core wire composed of a plurality of conductive wires and an inner covering the core wire,
- wherein the connector further includes a pressure-contact blade provided in the bottom part, and
- wherein in the third step, the pressure-contact blade penetrates the inner covering to be conductive to the core wire.
Dependencies are inferred from the claim text.