Thermosetting resin composition, interlayer insulation resin film, composite film, printed wiring board, and production method thereof
AssigneeResonac Corporation
InventorsAya Kasahara, Tetsurou Iwakura
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Abstract
The present invention relates to a thermosetting resin composition containing an inorganic filler (A1) containing a nanofiller (a), a thermosetting resin (B), and an elastomer (C); and a thermosetting resin composition containing an inorganic filler (A2), a thermosetting resin (B), and an elastomer (C), wherein the inorganic filler (A2) has at least two peaks of a first peak and a second peak in a particle size distribution measured according to the laser diffraction scattering method, and a peak position of the first peak appears at 0.3 to 0.7 μm, while a peak position of the second peak appears at 0.7 to 1.2 μm.
Claims8
A resin film for interlayer insulation, comprising a thermosetting resin composition comprising an inorganic filler (A1) containing nanofiller (a) selected from the group consisting of silica, alumina, and titanium oxide, the nanofiller (a) having an average particle diameter of 300 nm or less, and an inorganic filler (a′) other than the nanofiller (a), the inorganic filler (a′) comprising fused silica, a thermosetting resin (B), and an elastomer (C), wherein the content of nanofiller (a) is from 0.1 to 1.0% by mass relative to the total amount of the inorganic filler (A1), wherein the resin film does not contain a glass cloth, and wherein a thickness of the resin film is 5 to 100 μm.
Dependencies are inferred from the claim text.