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US 11,827,021 B2Granted
Applying mold chase structure to end portion of fluid ejection die
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Christopher A. Leonard, Anthony M. Fuller
Life of this patent
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Abstract
A method includes applying a mold chase to a fluid ejection die to at least partially define at least one cavity. The mold chase includes a feature to contact a fluid ejection portion of the fluid ejection die, and at least one structure separate from the feature to contact a first end portion adjacent a first end of the fluid ejection die. The method includes filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die.
Claims13
A method, comprising:
- applying a mold chase to a fluid ejection die to at least partially define at least one cavity, wherein the mold chase includes a feature to contact a fluid ejection portion of the fluid ejection die, and at least one structure separate from the feature to contact a first end portion adjacent a first end of the fluid ejection die;
- and
- filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die wherein the fluid ejection die includes a contact pad positioned in the first end portion, wherein the at least one structure includes a first plurality of structures laterally positioned between the contact pad and a first lateral end of the fluid ejection die, and a second plurality of structures laterally positioned between the contact pad and a second lateral end of the fluid ejection die.
A method, comprising:
- providing a fluid ejection die that includes a first end portion positioned adjacent a first end of the fluid ejection die, and a fluid ejection portion positioned adjacent the first end portion, wherein the fluid ejection die includes a contact pad positioned on a front side of the die in the first end portion;
- applying a mold chase to a back side of the fluid ejection die to at least partially define at least one cavity, wherein the mold chase includes a feature applied to the fluid ejection portion, and at least one structure separate from the feature applied to the first end portion of the fluid ejection die;
- and
- filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die, wherein the at least one structure includes a first plurality of structures laterally positioned between the contact pad and a first lateral end of the fluid ejection die, and a second plurality of structures laterally positioned between the contact pad and a second lateral end of the fluid ejection die.
1 more element
A method, comprising:
- providing a fluid ejection die that includes a first end portion positioned adjacent a first end of the fluid ejection die, a second end portion positioned adjacent a second end of the fluid ejection die, and a fluid ejection portion positioned between the first and second end portions;
- applying a mold chase to the fluid ejection die to at least partially define at least one cavity, wherein the mold chase includes a slot forming feature applied to the fluid ejection portion, and at least one hold-down structure applied to the first and second end portions of the fluid ejection die;
- and
- filling the at least one cavity with a mold compound to produce a molded carrier for the fluid ejection die, wherein the at least one hold-down structure includes a first structure applied to the first end portion, and wherein a length between an end of the first structure and the first end of the fluid ejection die is less than 1.5 mm.
1 more element
Dependencies are inferred from the claim text.