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US 11,826,992 B2Granted
Composite structure
AssigneeJiva Materials Ltd
InventorJack Herring
Life of this patent
Estimating the term…
Abstract
A composite structure 10 comprises one or more layers 12 of structural material and one or more layers of adhesive material 28 binding the one or more structural layers together. The one or more layers of structural material are coated with a bonding agent. The one or more layers of adhesive material are at least partially soluble or separable in water. A method of making a composite structure is also provided.
Claims12
An electronics circuit assembly substrate, comprising one or more layers of structural material, and one or more layers of adhesive material binding the one or more structural layers together, wherein:
- the one or more layers of adhesive material are at least partially soluble such that the structural layers are separable in water, the one or more layers of adhesive material comprising one of a starch-glycerine composition and a polyol composition;
- and
- the one or more layers of structural material comprise a biodegradable material.
Dependencies are inferred from the claim text.