Method of bonding thermoplastic resin and metal
AssigneeHirotec Corporation
InventorsKiminori Washika, Tatsumi Kawafuchi
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Abstract
The method of metal-thermoplastic resin direct bonding is characterized by comprising a first step for irradiating a surface of the metal material with a pulse laser under an oxidizing atmosphere to form a surface modification region, a second step for causing the thermoplastic resin material to abut against the surface modification region to form a bonding interface, and a third step for heating up the bonding interface by laser irradiation to achieve bonding, the first step including forming metal oxide particle clusters obtained when metal oxide particles having a particle diameter of 5-500 nm to be continuously bonded at the surface modification region, so that the maximum height (Sz) of a surface of the metal oxide particle clusters is 50 nm-3 μm.
Claims14
A metal-thermoplastic resin direct bonding method where a metal material and a thermoplastic resin material are directly bonded, which includes:
- a first step for irradiating a surface of the metal material with a pulse laser under an oxidizing atmosphere to form a surface modification region,
- a second step for abutting the thermoplastic resin material against the surface modification region to form an interface to be bonded, and
- a third step for heating up the interface to be bonded by laser irradiation to achieve bonding,
- wherein, in the first step, a metal oxide particle cluster in which metal oxide particles having a particle size of 5 to 500 nm are continuously bonded is formed in the surface modification region, and
- the maximum height (Sz) of the surface of the metal oxide particle cluster is 50 nm to 3 μm.
Dependencies are inferred from the claim text.