Diode laser arrangement and method for producing a diode laser arrangement

A diode laser configuration, comprising:

• a diode laser device;
• and
• at least one cooling device disposed on said diode laser device, wherein said at least one cooling device being configured to cool said diode laser device, wherein said at least one cooling device having a contact body and at least one heat-conducting insert, wherein said contact body having a first material or is composed of a first material, wherein said at least one heat-conducting insert having a second material differing from the first material, or is composed of said second material differing from the first material, wherein said contact body being disposed on said diode laser device, and wherein said at least one heat-conducting insert is embedded in said contact body, wherein said at least one heat-conducting insert is produced by means of sintering.

A diode laser configuration, comprising:

• a diode laser device;
• and
• at least one cooling device disposed on said diode laser device, wherein said at least one cooling device being configured to cool said diode laser device, wherein said at least one cooling device having a contact body and at least one heat-conducting insert, wherein said contact body having a first material or is composed of a first material, wherein said at least one heat-conducting insert having a second material differing from the first material, or is composed of said second material differing from the first material, wherein said contact body being disposed on said diode laser device, and wherein said at least one heat-conducting insert is embedded in said contact body, wherein said at least one heat-conducting insert is connected to said contact body by means of sintering.

A diode laser configuration, comprising:

• a diode laser device;
• and
• at least one cooling device disposed on said diode laser device, wherein said at least one cooling device being configured to cool said diode laser device, wherein said at least one cooling device having a contact body and at least one heat-conducting insert, wherein said contact body having a first material or is composed of a first material, wherein said at least one heat-conducting insert having a second material differing from the first material, or is composed of said second material differing from the first material, wherein said contact body being disposed on said diode laser device, wherein said at least one heat-conducting insert is embedded in said contact body, wherein said at least one cooling device has a separate cooling element which is thermally coupled to said contact body and/or to said at least one heat-conducting insert, and wherein said contact body and/or said at least one heat-conducting insert are/is connected to said separate cooling element by means of sintering or soldering.