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US 11,824,299 B2Granted
Connector
AssigneeSony Semiconductor Solutions Corporation
InventorsYoshitaka Yoshino, Toshiyuki Sudo
Life of this patent
Estimating the term…
Abstract
A connector includes a cable including at least one core wire and a shielding wire arranged around the core wire with an insulating member interposed therebetween, a plug part connected to the cable and capable of fitting with a receptacle, a primary molded part including a connection portion between the core wire and a conductive member of the plug part, and a secondary molded part arranged at a lead-out portion of the cable. The dimension of the primary molded part is an outer diameter or a thickness of the plug part.
Claims19
A connector comprising:
- a cable including at least one core wire and a shielding wire arranged around the core wire with an insulating member interposed therebetween;
- a plug part connected to the cable and capable of fitting with a receptacle;
- a primary molded part including a connection portion between the core wire and a conductive material of the plug part;
- and
- a secondary molded part arranged at a lead-out portion of the cable to abut an edge of the primary molded part, wherein
- the plug part includes a first outer diameter or thickness of the edge of the primary molded part which is equal to a second outer diameter or thickness of the secondary molded part,
- wherein, during a primary molding process of the primary molded part, a retaining portion is formed over a circumference of a surface of the primary molded part in a vicinity of the lead-out portion of the cable, and a resin for the secondary molded part enters the retaining portion during a secondary molding process of the secondary molded part to increase a strength and bendability of the connector at least on the lead-out portion of the cable.
4 more elements
A connector comprising:
- a cable having an outer sheath that includes at least one or more signal lines;
- a plug part connected to the cable and capable of fitting with a receptacle;
- a primary molded part including a connection portion between the signal lines and a conductive material of the plug part;
- and
- a secondary molded part arranged at a lead-out portion of the cable to abut an edge of the primary molded part, wherein
- the plug part includes a first outer diameter or thickness of the edge of the primary molded part which is equal to a second outer diameter or thickness of the secondary molded part, and
- wherein, during a primary molding process of the primary molded part, a retaining portion is formed over a circumference of a surface of the primary molded part in a vicinity of the lead-out portion of the cable, and a resin for the secondary molded part enters the retaining portion during a secondary molding process of the secondary molded part to increase a strength and bendability of the connector at least on the lead-out portion of the cable.
4 more elements
Dependencies are inferred from the claim text.