Sensor and method of forming the same
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsLanxiang Wang, Shyue Seng Tan, Eng Huat Toh
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Abstract
A sensor may be provided, including a substrate having a first semiconductor layer, a second semiconductor layer, and a buried insulator layer arranged between the first semiconductor layer and the second semiconductor layer. The sensor may further include a photodiode arranged in the first semiconductor layer; and a quenching resistive element electrically connected in series with the photodiode. The quenching resistive element is arranged in the second semiconductor layer, and the quenching resistive element is arranged over the photodiode but separated from the photodiode by the buried insulator layer.
Claims20
A method of forming a sensor, the method comprising:
- providing a substrate, wherein the substrate comprises a first semiconductor layer, a second semiconductor layer, and a buried insulator layer arranged between the first semiconductor layer and the second semiconductor layer;
- forming a photodiode in the first semiconductor layer;
- and
- forming a quenching resistive element in the second semiconductor layer;
- wherein the quenching resistive element is electrically connected in series with the photodiode;
- and wherein the quenching resistive element is arranged over the photodiode but entirely separated from the photodiode by the buried insulator layer.
Dependencies are inferred from the claim text.