Airlaid substrates having at least one bicomponent fiber
AssigneeDow Global Technologies LLC
InventorsLihua Chen, Phil Xu, Shenglong Chen
Life of this patent
Estimating the term…
Abstract
An airlaid substrate includes at least one bicomponent fiber having a first region and a second region. The first region includes polypropylene and the second includes a blend of an ethylene-base polymer and an ethylene acid copolymer. The ethylene-base polymer has a density from 0.920 g/cm3 to 0.970 g/cm3 and a melt index (I2) from 0.5 g/10 min to 150 g/10 min. The ethylene acid copolymer includes the polymerized reaction product of from 60 wt % to 99 wt % ethylene monomer and from 1 wt % to 40 wt % unsaturated dicarboxylic acid comonomer, based on the total weight of the monomers in the ethylene acid copolymer. The ethylene acid copolymer having a melt index (I2) from 0.5 g/10 min to 500 g/10 min.
Claims17
An airlaid substrate comprising at least one bicomponent fiber having a first region and a second region, wherein:
- the first region comprises polypropylene;
- and
- the second region comprises a blend of:
- an ethylene-based polymer having a density from 0.920 g/cm3 to 0.970 g/cm3 and a melt index (I2) from 0.5 g/10 min. to 150 g/10 min., as determined by ASTM D1238 at 190° C. and 2.16 kg;
- and
- an ethylene acid copolymer comprising the polymerized reaction product of from 60 wt. % to 99 wt. % ethylene monomer and from 1 wt. % to 40 wt. % unsaturated dicarboxylic acid comonomer, based on the total weight of the monomers in the ethylene acid copolymer, the ethylene acid copolymer having a melt index (I2) from 0.5 g/10 min. to 500 g/10 min., as determined by ASTM D1238 at 190° C. and 2.16 kg.
Dependencies are inferred from the claim text.