Microelectromechanical apparatus having hermitic chamber
AssigneeIndustrial Technology Research Institute
InventorsBor-Shiun Lee, Ming-Fa Chen, Yu-Wen Hsu, Chao-Ta Huang
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Abstract
The disclosure relates to a microelectromechanical apparatus including a substrate, a stationary electrode, a movable electrode, and a heater. The substrate includes an upper surface, an inner bottom surface, and an inner side surface. The inner side surface surrounds and connects with the inner bottom surface. The inner side surface and the inner bottom surface define a recess. The stationary electrode is disposed on the inner bottom surface. The movable electrode covers the recess. The movable electrode, the inner bottom surface, and the inner side surface define a hermetic chamber. The heater is disposed on the movable electrode and located above the hermetic chamber.
Claims21
A microelectromechanical apparatus, comprising:
- a substrate, comprising:
- an upper surface;
- an inner bottom surface;
- and
- an inner side surface, surrounding and connecting with the inner bottom surface, wherein the inner side surface and the inner bottom surface define a recess formed by being recessed downwards from the upper surface;
- a stationary electrode, disposed on the inner bottom surface;
- an electrically conductive movable electrode, covering the recess, wherein the electrically conductive movable electrode, the inner bottom surface, and the inner side surface define a hermetic chamber;
- and
- a heater, disposed on the electrically conductive movable electrode and located above the hermetic chamber;
- wherein the microelectromechanical apparatus further comprises a temperature sensor disposed on the electrically conductive movable electrode;
- wherein the microelectromechanical apparatus further comprises an electrical insulation layer disposed between the heater and the electrically conductive movable electrode, and the electrical insulation layer is disposed between the temperature sensor and the electrically conductive movable electrode;
- and
- wherein the microelectromechanical apparatus further comprises a sensing module configured to sense gas or humidity, the sensing module is disposed above the heater, and the heater is disposed between the sensing module and the electrically conductive movable electrode.
A microelectromechanical apparatus, comprising:
- a substrate, comprising:
- an upper surface;
- an inner bottom surface;
- and
- an inner side surface, surrounding and connecting with the inner bottom surface, wherein the inner side surface and the inner bottom surface define a recess formed by being recessed downwards from the upper surface;
- a pressure sensor, disposed on the recess, comprising:
- a stationary electrode, disposed on the inner bottom surface;
- and
- an electrically conductive movable electrode, covering the recess, wherein the electrically conductive movable electrode, the inner bottom surface, and the inner side surface define a hermetic chamber;
- a gas sensor, disposed on the pressure sensor, and comprising:
- a heater, disposed on the electrically conductive movable electrode and located above the hermetic chamber;
- an electrical insulation layer, disposed between the heater and the electrically conductive movable electrode;
- a sensing electrode, disposed above the heater and electrically insulated from the heater, wherein the heater is disposed between the sensing electrode and the electrically conductive movable electrode;
- and
- a sensing material layer, covering the sensing electrode;
- and
- a temperature sensor, disposed on the pressure sensor, wherein the temperature sensor is disposed on the electrically conductive movable electrode and located above the hermetic chamber, and the electrical insulation layer is disposed between the temperature sensor and the electrically conductive movable electrode;
- wherein the substrate further comprises an integrated circuit electrically connected to the stationary electrode, the electrically conductive movable electrode, the heater, and the temperature sensor;
- wherein the integrated circuit is used to control the heater to heat the electrically conductive movable electrode of the pressure sensor;
- and
- wherein the integrated circuit receives a first electrical signal sensed by the temperature sensor and a second electrical signal sensed by the stationary electrode and the electrically conductive movable electrode to calibrate a pressure value.
Dependencies are inferred from the claim text.