Conductive circuit-attached molded product and manufacturing method for the same, and conductive circuit-attached preform and manufacturing method for the same

A conductive circuit-attached molded product achieved by blow molding, wherein

• a conductive circuit-attached film in which a conductive circuit having stretchability is formed on a first surface of a base film, is integrally molded on an internal surface of the conductive circuit-attached molded product, and a surface of the conductive circuit-attached film is exposed from an internal surface of the conductive circuit-attached molded product;
• and
• an electronic component, mounted on a second surface of the base film in such a manner that the electronic component is electrically connected to the conductive circuit and the electronic component faces the internal surface of the preform.

A conductive circuit-attached preform configured to achieve a conductive circuit-attached molded product by blow molding, the preform comprising:

• a conductive circuit-attached film in which a conductive circuit having stretchability is formed on a first surface of a base film, and which is arranged on an internal surface of the preform;
• and
• an electronic component, mounted on a second surface of the base film in such a manner that the electronic component is electrically connected to the conductive circuit and the electronic component faces the internal surface of the preform.