Method for processing electronic/electrical device component scraps
AssigneeJX Metals Corporation
InventorsKatsushi Aoki, Hidetoshi Sasaoka
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Abstract
Provided is a method for processing electronic and electrical device component scraps, which can selectively recover a substrate scrap including a substance intended to be recovered. A method for processing electronic and electrical device component scraps, including separating a substrate with lead wires contained in the electronic and electrical device component scraps before sorting the electronic and electrical device component scraps by magnetic sorting.
Claims5
A method for processing electronic and electrical device component scraps, comprising separating a substrate with lead wires contained in the electronic and electrical device component scraps by performing a wind power sorting at a wind velocity between 15 to 20 m/s by using a wind power sorting device which comprises a guide portion provided therein and being arranged such that an airflow which is brought into contact with the substrate with lead wires in a perpendicular direction to a lower surface of the substrate with lead wires, before sorting the electronic and electrical device component scraps by magnetic sorting.
Dependencies are inferred from the claim text.