US 11,813,800 B2Granted

Method and apparatus for improved ultrasonic bonding

AssigneeCurt G. Joa, Inc.

InventorsDavid E. Schuette, Jeffrey W. Fritz, Justin M. Lafferty

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Abstract

A system and method for controlling the speed of both a continuous web and a bonding apparatus is provided in order to effectuate stronger bonds in the web. The bonding system includes a velocity changing device for increasing and decreasing a velocity of the web in a machine direction, an anvil and a corresponding ultrasonic horn that interact to form ultrasonic bonds on the web, and an anvil actuator configured to control a movement of the anvil. A control system is also included in the bonding system for controlling operation of the anvil actuator the velocity changing device, with the control system programmed to decrease a moving velocity of the web from a feed velocity to a bonding velocity as the web passes between the anvil and the ultrasonic horn and control movement of the anvil to synchronize the movement of the anvil with the moving velocity of the web.

Claims20

Dependent claims

A bonding system for bonding a web comprising at least a pair of web layers, the bonding system comprising:

a first bonding unit configured to form bonds on the web;
a second bonding unit spaced apart from the first bonding unit in a machine direction and configured to form bonds on the web;
a base structure comprising one or more sections, with the first bonding unit and the second bonding unit coupled to the base structure, and with one or both of the first bonding unit and the second bonding unit being translatable along the base structure in the machine direction or opposite the machine direction;
an actuating structure configured to translate one or both of the first bonding unit and the second bonding unit along the base structure;
a vision system configured to acquire positional data of the first bonding unit and the second bonding unit while the first and second bonding units are forming bonds;
and
a control system operably connected to the actuating structure and to the vision system, the control system including a processor configured to:
receive the positional data from the vision system;
analyze the positional data to determine a current spacing between the first bonding unit and the second bonding unit;
compare the current spacing between the first bonding unit and the second bonding unit to a target spacing;
and
when the current spacing does not match the target spacing:
automatically cause the actuating structure to translate one or both of the first bonding unit and the second bonding unit while the first and second bonding units are forming bonds along the base structure until a spacing between the first bonding unit and the second bonding unit matches the target spacing;
or
generate an operator output in operation indicating that the current spacing does not match the target spacing.

12 more elements

A method for controlling positioning of a first bonding unit and a second bonding unit in a bonding system for bonding a web comprising at least a pair of web layers, the method comprising:

acquiring while the first and second bonding units are forming bonds, via a vision system associated with the bonding system, positional data on the first bonding unit and the second bonding unit regarding positioning thereof on a base structure that extends along a machine direction;
analyzing, via a processor of a control system associated with the bonding system, the positional data to determine a current spacing between the first bonding unit and the second bonding unit along the base structure;
comparing, via the processor, the current spacing between the first bonding unit and the second bonding unit to a target spacing;
and
when the current spacing does not match the target spacing, controlling while the first and second bonding units are forming bonds, via the processor, an actuating structure operably connected to one or both of the first bonding unit and the second bonding unit, the actuating structure being controlled to translate one or both of the first bonding unit and the second bonding unit along the base structure until a spacing between the first bonding unit and the second bonding unit matches the target spacing.

2 more elements

A method for controlling positioning of a first bonding unit and a second bonding unit in a bonding system for bonding a web comprising at least a pair of web layers, the method comprising:

acquiring while the first and second bonding units are forming bonds, via a vision system associated with the bonding system, positional data on the first bonding unit and the second bonding unit regarding positioning thereof on a base structure that extends along a machine direction;
analyzing, via a processor of a control system associated with the bonding system, the positional data to determine a current spacing between the first bonding unit and the second bonding unit along the base structure;
comparing, via the processor, the current spacing between the first bonding unit and the second bonding unit to a target spacing;
and
when the current spacing does not match the target spacing, generating while the first and second bonding units are forming bonds, via the processor, an operator output indicating that the current spacing does not match the target spacing.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/457,715Filed 6 Dec 2021 · continuation
Priority: 11 Jul 2019
Published: US 2022/0088885 A124 Mar 2022
Granted: 14 Nov 2023
Term ends: Not estimatedThe source records don’t support an estimate.

Classification27 codes

A61F 13/15739
Mechanical treatment, e.g. notching, twisting, compressing, shaping: sealing, e.g. involving cutting
B29C 65/08
By heating, with or without pressure: using ultrasonic vibrations
B29C 65/086
Using a rotary sonotrode or a rotary anvil: using a rotary anvil
B29C 66/1122
Single lapped joints: single lap to lap joints, i.e. overlap joints

Family

Application16/508,422Parent of this continuation · filed 11 Jul 2019
US 2022/0088885 A1Pre-grant publication · published 24 Mar 2022
US 11,192,310 B2Parent of this continuation
US 2021/0008809 A1Published application
US 11,813,800 B2This patent

From the US filing history. Foreign family members aren’t listed.