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US 11,811,385 B2Granted
Bulk acoustic wave component with conductor extending laterally from via
AssigneeSkyworks Solutions, Inc.
InventorsAtsushi Takano, Takeshi Furusawa, Mitsuhiro Furukawa
Life of this patent
Estimating the term…
Abstract
Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components.
Claims20
A bulk acoustic wave component comprising:
- a substrate having a via extending therethrough;
- at least one bulk acoustic wave resonator on the substrate;
- a cap enclosing the at least one bulk acoustic wave resonator, the cap including a sidewall spaced apart from an edge of the substrate, the sidewall being 5 microns or less from the edge of the substrate;
- and
- a conductor extending laterally from the via and electrically connected with a conductive layer in the via, the conductor being on an opposite side of the substrate than the at least one bulk acoustic wave resonator, the conductor having solder thereon, and the solder being non-overlapping with the via.
2 more elements
A radio frequency module comprising:
- a bulk acoustic wave component including at least one bulk acoustic wave resonator on a substrate, a cap enclosing the at least one bulk acoustic wave resonator and including a sidewall spaced apart from an edge of the substrate by 5 microns or less, and a conductor extending laterally from a via extending through the substrate, the conductor being electrically connected with a conductive layer in the via, and the conductor having solder thereon such that the solder in non-overlapping with the via;
- a radio frequency switch connected to a filter than includes the at least one bulk acoustic wave resonator;
- and
- a package enclosing the bulk acoustic wave component and the radio frequency switch.
1 more element
A wireless communication device comprising:
- an antenna;
- and
- a bulk acoustic wave component including bulk acoustic wave resonators on a substrate, a cap enclosing the bulk acoustic wave resonators and including a sidewall spaced apart from an edge of the substrate by 5 microns or less, and a conductor extending laterally from a via extending through the substrate, the conductor being electrically connected with a conductive layer in the via, the conductor having solder thereon such that the solder in non-overlapping with the via, the bulk acoustic wave resonators being included in a filter in communication with the antenna.
Dependencies are inferred from the claim text.