Film capacitor and dielectric resin film for film capacitor
AssigneeMurata Manufacturing Co., Ltd.
InventorTakumi Furuhashi
Life of this patent
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Abstract
A film capacitor that includes: a dielectric resin film; and a metal layer on at least one surface of the dielectric resin film. The dielectric resin film contains at least one skeleton selected from the group consisting of a biphenyl skeleton, a bisphenol acetophenone skeleton, a bisphenol fluorene skeleton, a bisphenol S skeleton, a bisphenol cyclohexanone skeleton, and an epoxy-modified bisphenol A skeleton.
Claims24
A film capacitor comprising:
- a dielectric resin film;
- and
- a metal layer on at least one surface of the dielectric resin film,
- wherein the dielectric resin film contains at least one skeleton selected from the group consisting of a biphenyl skeleton, a bisphenol acetophenone skeleton, a bisphenol fluorene skeleton, a bisphenol S skeleton, and a bisphenol cyclohexanone skeleton.
A film capacitor comprising:
- a dielectric resin film;
- and
- a metal layer on at least one surface of the dielectric resin film, wherein:
- the dielectric resin film contains a cured resin obtained from a first organic material and a second organic material as a main component of the cured resin;
- and
- the first organic material is a phenoxy resin containing a first phenoxy resin having a glass transition temperature Tg higher than 87° C.
- wherein the first phenoxy resin contains at least one skeleton selected from the group consisting of a biphenyl skeleton, a bisphenol acetophenone skeleton, a bisphenol fluorene skeleton, a bisphenol S skeleton, and a bisphenol cyclohexanone skeleton.
A dielectric resin film for film capacitors, the dielectric resin film comprising at least one skeleton selected from the group consisting of a biphenyl skeleton, a bisphenol acetophenone skeleton, a bisphenol fluorene skeleton, a bisphenol S skeleton, and a bisphenol cyclohexanone skeleton.
Dependencies are inferred from the claim text.