Method for producing a microoptoelectromechanical component, and corresponding microoptoelectromechanical component

A method for producing a microoptoelectromechanical component, comprising the following steps:

• providing a base substrate including a cavity which is formed therein and is closed by a covering substrate;
• forming an optical waveguide on the covering substrate above the cavity, the optical waveguide including a sheathed waveguide core;
• applying an electrically conductive first hard mask layer over the optical waveguide and a surrounding part of the covering substrate;
• forming an electrical contact element on the first hard mask layer in a region of the surrounding part of the covering substrate;
• applying a second hard mask layer over the first hard mask layer and the electrical contact element;
• forming an etching opening in the first hard mask layer and the second hard mask layer for exposing some regions of an upper face of the optical waveguide;
• trench-etching the optical waveguide and the covering substrate located thereunder to divide the optical waveguide and the covering substrate located thereunder into a stationary portion and a deflectable portion which can be docked to the stationary portion by electrically deflecting the corresponding portion of the covering substrate;
• and
• removing the exposed first and second hard mask layers, wherein a contact pad formed by the electrically conductive first hard mask layer remains underneath the electrical contact element.