Methods for producing an etch resist pattern on a metallic surface
AssigneeKateeva, Inc.
InventorsNava Shpaisman, Moshe Frenkel
Life of this patent
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Abstract
A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.
Claims20
A method of forming a metallic pattern on a substrate, the method comprising:
- chemically activating a metallic surface of a substrate to form metal ions;
- after chemically activating the metallic surface, selectively printing an etch-resist ink onto the metallic surface;
- reacting a component of the etch-resist ink with the ions to immobilize the etch-resist ink into an etch-resist mask on the metallic surface;
- and
- performing an etching process to remove portions of the metallic layer that are not covered by the etch-resist mask to form the metallic pattern.
A method of forming a metallic pattern on a substrate, the method comprising:
- forming metal ions on a metallic surface of a substrate by applying an aqueous solution comprising an inorganic agent onto the metallic surface;
- ink-jet printing a reactive ink onto the metallic surface;
- reacting a component of the reactive ink with the ions to produce a resist;
- performing an etching process to remove portions of the metallic layer that are not covered by the resist;
- and
- removing the resist to form the metallic pattern.
A method of forming a pattern on a copper substrate, the method comprising:
- activating a copper surface of a substrate by applying an aqueous solution comprising an inorganic activating agent selected from the group consisting of a copper salt, a ferric salt, a chromic-sulfuric acid, a persulfate salt, sodium chlorite, and hydrogen peroxide onto the metallic surface;
- after chemically activating the copper surface, ink-jet printing an ink comprising an acrylate, a phosphate, a sulfonate, or a combination thereof onto the copper surface;
- reacting a component of the ink with copper ions of the copper surface to produce a resist;
- performing an etching process to remove portions of the copper surface that are not covered by the resist;
- and
- removing the resist to form the pattern on the copper surface.
Dependencies are inferred from the claim text.