Processes for producing granular copper
AssigneeDestiny Copper Inc.
InventorsIan David Brindle, Molina Audrey Lorraine Sheepwash
Life of this patent
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Abstract
Processes for producing copper granules on a surface of a reducing metal. The process can include contacting the reducing metal with an aqueous solution comprising a copper(II) salt and a halide. The molar ratio of the halide to the copper(II) in the copper (II) salt can be at least about 3:1. The granular copper can be produced on a surface of the reducing metal, and is optionally removed from the surface of the reducing metal by shaking, washing, and/or brushing, and/or optionally with stirring and/or circulating of the aqueous solution.
Claims18
A process, comprising:
- preparing an aqueous solution comprising a copper(II) salt and a halide;
- contacting a reducing metal with the aqueous solution;
- stirring and/or circulating the aqueous solution;
- producing granular copper on a surface of the reducing metal and is weakly adhered thereto;
- and
- removing the granular copper from the surface of the reducing metal by force of gravity without scraping,
- wherein the reducing metal is iron,
- wherein the molar ratio of the halide to the copper(II) in the aqueous solution is from about 3:1 to about 5:1, and
- wherein the aqueous solution has a pH between about 2 and about 3.
A process for producing granular copper metal, the process comprising contacting a reducing metal with an aqueous solution,
- wherein the aqueous solution comprises:
- (i) a copper(II) salt;
- and
- (ii) a halide,
- wherein the reducing metal is iron,
- wherein the halide is chloride,
- wherein the molar ratio of the halide to the copper(II) in the aqueous solution is from about 3:1 to about 5:1,
- wherein the aqueous solution has a pH between about 2 and about 3, and
- wherein the granular copper is produced on a surface of the reducing metal and is weakly adhered thereto.
A process, comprising:
- leaching a copper ore with sulfuric acid to obtain a copper(II) salt;
- adding sodium chloride to the copper(II) salt to prepare an aqueous solution;
- contacting a reducing metal with the aqueous solution;
- stirring and/or circulating the aqueous solution;
- and
- producing granular copper on a surface of the reducing metal and is weakly adhered thereto,
- wherein the reducing metal is iron,
- wherein the molar ratio of the sodium chloride to the copper(II) in the aqueous solution is from about 3:1 to about 5:1, and
- wherein the aqueous solution has a pH between about 2 and about 3.
Dependencies are inferred from the claim text.