Spin dispenser module substrate surface protection system

A method comprising:

• loading a wafer into a spin dispenser;
• depositing a photoresist on the wafer;
• exposing the photoresist to a patterned light;
• after exposing the photoresist to the patterned light, dispensing a liquid material from a liquid dispensing nozzle onto the photoresist, the liquid material comprising a photoresist developer, the liquid material causing a portion of the photoresist to become a dissolved photoresist;
• after dispensing the liquid material, performing a rinsing, the rinsing removing the dissolved photoresist from the wafer;
• after the rinsing, drying the wafer;
• while drying the wafer, removing a volume of ambient atmosphere directly over the wafer through one or more ejectors disposed in the volume of ambient atmosphere, the one or more ejectors being disposed a distance from the wafer which is vertically further than the liquid dispensing nozzle;
• and
• removing the wafer from the spin dispenser.

A method comprising:

• dispensing a liquid coating onto a substrate disposed in a spin dispenser, the dispensing being from a liquid dispensing nozzle positioned above the substrate, the liquid coating covering the substrate entirely, wherein dispensing the liquid coating causes gaseous materials to be suspended above the liquid coating, the gaseous materials originating from the liquid coating;
• removing the gaseous materials suspended above the substrate through one or more ejector inlets, the one or more ejector inlets being attached to the liquid dispensing nozzle, wherein removing the gaseous materials suspended above the substrate does not disturb a surface pattern of the liquid coating;
• and
• removing the substrate from the spin dispenser.