Systems and methods for shielded inductive devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng Wei Kuo, Chewn-Pu Jou, Huan-Neng Chen, Lan-Chou Cho, Robert Bogdan Staszewski
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Abstract
In an embodiment, a circuit includes: a transformer defining an inductive footprint within a first layer; a grounded shield bounded by the inductive footprint within a second layer separate from the first layer; and a circuit component bounded by the inductive footprint within a third layer separate from the second layer, wherein: the circuit component is coupled with the transformer through the second layer, and the third layer is separated from the first layer by the second layer.
Claims20
A method, comprising:
- forming a first layer with a circuit component bound within an inductive footprint;
- forming a second layer with a grounded shield bounded by the inductive footprint, the second layer separate from the first layer;
- and
- forming a third layer with an inductor that defines the inductive footprint, the third layer separated from the first layer via the second layer, wherein the circuit component is coupled with the inductor through the second layer, wherein a port of the inductor faces winding structures of the inductor within the inductor,
- wherein the circuit component comprises a transformer having at least two inductors.
A method, comprising:
- forming an inductor defining an inductive footprint within a first layer;
- forming a grounded shield laterally bounded by the inductive footprint so as to be surrounded by an outer perimeter of the inductive footprint, wherein the grounded shield is formed within a second layer separate from the first layer;
- and
- forming a circuit component laterally bounded by the inductive footprint so as to be surrounded by an outer perimeter of the inductive footprint, wherein the circuit component is formed within a third layer separate from the second layer, wherein a port of the inductor faces winding structures of the inductor within the inductor, and
- wherein the circuit component comprises a transformer having at least two inductors.
A method, comprising:
- forming an inductor defining an inductive footprint within a first layer;
- forming a grounded shield laterally bounded by the inductive footprint, wherein the grounded shield is formed within a second layer separate from the first layer;
- and
- forming a circuit component laterally bounded by the inductive footprint, wherein the circuit component is formed within a third layer separate from the second layer, wherein:
- the circuit component is coupled with the inductor through the second layer,
- the third layer is separated from the first layer by the second layer, and
- the circuit component is laterally surrounded by winding structures of a transformer.
Dependencies are inferred from the claim text.