Lead-free glass paste, chip resistor and method for producing same

A method for producing a lead-free glass paste, wherein the lead-free glass paste comprises 6-7 parts by mass of borosilicate oil, 12-21 parts by mass of aluminum oxide powder, 2-3 parts by mass of glass fiber powder, and 0.1-0.5 parts by mass of a curing agent, and wherein the method comprises:

• preparing the borosilicate oil;
• uniformly mixing the borosilicate oil with the aluminum oxide powder and the glass fiber powder to obtain a mixture;
• and
• adding the curing agent to the mixture to undergo a curing reaction, and then crushing to obtain the lead-free glass paste.

A method for producing a chip resistor, comprising:

• providing a substrate;
• forming a backside electrode on a lower surface of the substrate;
• forming a topside electrode, a barrier layer and an external electrode, wherein one end of the topside electrode is in contact with the backside electrode, and another end extends from a side wall of the substrate ti an upper surface of the substrate;
• the barrier layer is located on a surface of the topside electrode away from the substrate;
• and the external electrode is located on a surface of the barrier laver away from the topside electrode;
• forming a resistive layer on the upper surface of the substrate, wherein the resistive layer is located on a side of the topside electrode;
• preparing a lead-free glass paste;
• coating an upper surface of the resistive layer with the lead-free glass paste to form a first protective layer;
• and
• forming a second protective layer on an upper surface of the first protective layer,
• wherein the lead-free glass paste comprises 6-7 parts by mass of borosilicate oil, 12-21 parts by mass of aluminum oxide powder, 2-3 parts by mass of glass fiber powder and 0.1-0.5 part by mass of a curing agent, and
• wherein the lead-free glass paste is produced by a method comprising:
• preparing the borosilicate oil;
• uniformly mixing the borosilicate oil with the aluminum oxide powder and the glass fiber powder to obtain a mixture;
• and
• adding the curing agent to the mixture to undergo a curing reaction, and then crushing to obtain the lead-free glass paste.