Laser processing device for processing shielded conductors and method for operating a laser processing device for processing shielded conductors

A laser processing device for processing shielded conductors, the laser processing device comprising:

• a processing chamber configured to process an end portion of a shielded conductor disposed therein using laser radiation, the processing chamber being surrounded by a housing defining an opening into the processing chamber, wherein, in a processing position of the laser processing device, the end portion of the shielded conductor is inserted along an insertion axis into the opening and extends into the processing chamber;
• and
• a gripping device configured to fix the shielded conductor in the opening in the processing position of the laser processing device, the gripping device being movable along the insertion axis relative to the housing;
• wherein, in the processing position of the laser processing device, the gripping device is positioned at the housing without contact therebetween, and
• wherein the gripping device includes a first projection portion which extends at least partially into the opening along the insertion axis in the processing position of the laser processing device.