Heat pipe with multiple stages of cooling
AssigneeGM Global Technology Operations LLC
InventorsNicholas W. Pinto, Chih-hung Yen, Nathan Thompson, Anne M. Dailly
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AssigneeGM Global Technology Operations LLC
InventorsNicholas W. Pinto, Chih-hung Yen, Nathan Thompson, Anne M. Dailly
Estimating the term…
A heat pipe is provided for cooling an electronic component of a printed circuit board. The heat pipe includes a tube having an inner diameter surface defining a bore, with the tube having first and second ends along the bore. The heat pipe further includes a sorbent material coated onto the inner diameter surface of the tube, a first liquid contained within the bore, and a second liquid adsorbed by the sorbent material. The second liquid has a second boiling temperature that is higher than a first boiling temperature of the first liquid. The first liquid vaporizes into a first vapor, in response to the tube receiving heat from the electronic component and the first liquid reaching the first boiling temperature. The second liquid is desorbed from the sorbent material and vaporizes into a second vapor in response to the second liquid reaching the second boiling temperature.
A heat pipe for an electronics cooling system having an electronic component, the heat pipe comprising:
An electronics cooling system comprising:
A method of operating an electronics cooling system having an electronic component and a heat pipe attached to the electronic component, with the heat pipe including a tube having first and second ends and having an inner diameter surface defining a bore, a sorbent material coated onto the inner diameter surface, a first liquid having a first boiling temperature and contained within the bore, a second liquid having a second boiling temperature and adsorbed into the sorbent material, at least one thermocouple attached to at least one of the electronic component and the heat pipe, and a controller, the method comprising:
Dependencies are inferred from the claim text.